Wafer Basket Lifting Mechanism + Wafer Transfer Mechanism Creo(ProE) 3D Model

Wafer Basket Lifting Mechanism : Wafers are supplied in a basket, the basket needs to be lifted and indexed on the feeding module to move in and out of the basket one by one Wafer Transfer Mechanism : Wafers are taken out of the basket by the wafer transfer mechanism and sent to the wafer table for chip pickup, and then sent back to the basket by the transfer mechanism for wafer change after all chips have been picked up. This module is the standard module for Die Bonder or semiconductor equipments. This module is a standard module used in Die Bonder or semiconductor equipment. The module is a standard module used in Die Bonder or semiconductor equipment. The stp version is included, welcome to download!