Wafer Basket Lifting Mechanism + Wafer Conveying Mechanism – 3D Model ProE

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Wafer basket lifting mechanism: Wafers are fed by baskets, and the baskets need to be lifted and indexed on the feeding module to move wafers in and out of the baskets one by one. Wafer transfer mechanism: Wafers are taken out of the baskets by the wafer transfer mechanism and sent to the wafer workbench for chip suction. After all chips are sucked, they are sent to the baskets by the transfer mechanism for chip replacement. This module is a common standard module in Die Bonder or semiconductor equipment. Contains stp version, welcome to download!

Specification: Wafer Basket Lifting Mechanism + Wafer Conveying Mechanism – 3D Model ProE

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Wafer Basket Lifting Mechanism + Wafer Conveying Mechanism – 3D Model ProE
Wafer Basket Lifting Mechanism + Wafer Conveying Mechanism – 3D Model ProE
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