Semiconductor Packaging Equipment DB Discharge Module – 3D Model ProE
Magazine discharging module: The lead frame or substrate after chip bonding is sent to the magazine discharging module via a conveyor mechanism for storage and neatly stacked in the magazine. Empty materials can be automatically replaced when the magazine is full. box. This module is a commonly used standard module in Die Bonder or semiconductor equipment. Contains stp version, welcome to download!
Specification: Semiconductor Packaging Equipment DB Discharge Module – 3D Model ProE
|
User Reviews
Be the first to review “Semiconductor Packaging Equipment DB Discharge Module – 3D Model ProE”
You must be logged in to post a review.
There are no reviews yet.