Semiconductor Fully Automatic Taping Machine – 3D Model SolidWorks
The 3D model of the fully automatic taping machine is a semiconductor taping and packaging machine. The design principle is to use a 45-degree gravity descent to allow the product in the material tube to flow down from the material tube by itself. In order to prevent material jamming, a blowing function is added in the middle. The taping packaging is completed by a 45-degree pick-up and put-out robot. The pick-up and put-out speed of this robot is also very fast. A CCD visual camera can be seen in the middle for detection.
Specification: Semiconductor Fully Automatic Taping Machine – 3D Model SolidWorks
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