Optical Communication 128G Card Automatic Assembly Line – 3D Model SolidWorks

The structure of this equipment is designed by SW2016 and includes editable part features. This equipment has high requirements on the angle and position accuracy of chip mounting, but not on the efficiency of the equipment. The whole machine has three cameras. Compared with traditional machines, in addition to the linear motion characteristics of the bonding head, there is an additional camera for secondary positioning of the chip, which avoids the angle and position changes caused by the nozzle picking up the chip. According to the chip size, the chip mounting accuracy can be maintained within plus or minus 12~20um, meeting the product quality requirements of TO packaging. Weight and power supply: about 800kg, 220 VAC; power: 2000W; air pressure and dispensing method: 4bar ≤P≤6 bar, air extrusion and adhesive are optional; chip: 0.2mm x0.2mm ~1mm x 1mm; chip loading: 6-inch WAFER reel with expansion ring or TRAY reel; video system: 3 visual positioning systems for WAFER reel, 2 visual positioning systems for TRAY reel; control method: industrial computer; UPH: 1000~2000 PCS; patch accuracy: ±20 um, within ±0.5°. Contains STP and UG universal editable formats.