COF fixes the driver IC on a flexible circuit board with a soft film structure, which is a technology that utilizes a flexible additional circuit board as a carrier for encapsulating the chip and joining the chip with a flexible substrate circuit. ….. Bonding machine is an important equipment in COF process, which is mainly used in LCD and OLED industry. n This equipment contains the whole structure of Bonding machine, which can be modified and edited for the reference of related industries. n Flexible OLED screen with COF packaging technology.
Specification: OLED COF Fully Automatic Bonding Equipment Exported 3D Model
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OLED COF Fully Automatic Bonding Equipment Exported 3D Model
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