OLED COF Fully Automatic Bonding Equipment – 3D Model Exported
COF is a technology that uses a soft additional circuit board as a chip carrier to bond the chip to the flexible substrate circuit.
The bonding machine is an important equipment in the COF process, mainly used in the LCD and OLED industries.
The equipment contains the entire structure of the bonding machine, which can be modified and edited, and can be used as a reference for related industries.
Flexible OLED screen and COF packaging technology.
Specification: OLED COF Fully Automatic Bonding Equipment – 3D Model Exported
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