Offline Chute Pile Loader (Chip Loader) SolidWorks 3D Model

1, Production process The equipment loads wafers from the stacking cassettes into the wet baskets used in the down making machine. Functional modules of the equipment include: stacking cassette assembly, cassette changer assembly, wafer transfer assembly, top wafer assembly, air blowing assembly, buffer assembly, double and multiple wafer detection and rejection assembly, elastic belt conveyor assembly, telescopic wafer loading assembly, elevated wafer loading assembly, and basket conveyor assembly. n2.Tooling Wafer magazine: 400 wafers (166-182 compatible) Wafer basket: 100 wafers Pitch 4.76mm/120 wafers 4.12mm n3. Applicable wafers Overall dimensions: 156-182 Thickness 0.16-0.24mm n4.Capacity: 6000-8000pcs/h n5, Single unit fragmentation rate: ≦0.02% (except the original fragmentation) A wafer n6, single polycrystalline: single polycrystalline compatible n7, Number of channels: 2 channels n8, Number of baskets temporary storage: 8 n9, equipment size: 3820 * 1450 * 1850 (L * W * H unit mm) n10. Power supply: 220V 50-60Hz n11, Compressed air: 0.5-0.7MPa n12, Power: 3.2kw