IC Bonding Machine – 3D Model SolidWorks

This is the main moving mechanism of the IC bonding machine. The principle is to bond the IC to the glass. The fully automatic bonding machine is used for mass production. As long as you debug the machine well, it is very stable. We now have many varieties of automatic bonding machines, but the principle is the same. The glass is sucked up from the conveyor belt, and then placed on the ACF platform to press the ACF. Then the pre-pressing arm sucks the glass and puts it on the pre-pressing platform, pre-presses the IC, and then puts it on the main pressing platform for main pressing.