Chip Grab Test Equipment (With PPT Equipment Flow Explanation) SolidWorks 3D Model

Chipset using Tray feeding two groups switching uninterrupted feeding, 3-axis XYZ module equipped with bidirectional pitch module adsorption products, pitch into the test group after the test group detection, automatic sub OK / NG, n Chip grabbing test equipment (with PPT equipment flow explanation) operation introduction: n1. Manually put in the circuit board, the inner cavity guide positioning; n2. Manually put into the chip Tray two groups; n3. Photoelectric detection of the material in place, the equipment is ready to state, the manual button to start the equipment; n4. discharging under the pressure plate to move to avoid the position, the suction nozzle pitch to move to Tray to absorb the material, pitch after the downward pressure loaded into the circuit board; n5. Unloading and replacement of material tips; n6. Empty Tray out, into the new material Tray, another tray number of locations in the device memory; n7. Discharge position of each two rows can be single-selected;