Chip Component High Temperature Test After The Carrier Tape Packaging Machine – 3D Model SolidWorks

3D model of SMD component high temperature test and packaging machine SolidWorks2014 software design Sldprt, Sldasm source files + STEP general files are provided. After the SMD components are tested, they are directly loaded into the carrier tape and put on the SMT machine. This machine can test multiple components at the same time. The equipment is referred to as high temperature test packaging machine. After decompression, it is more than 120M, with a relatively complete structure. It is a good model for learning and research. Welcome to download.