Automatic Feeding And Receiving Mechanism For LED Die Bonding Machine Substrate – 3D Model ProE Creo.Parametric
This structure is an automatic loading and unloading mechanism for substrates in LED die bonding machines. It can collect die-bonded substrates, or add a set of cylinder ejection mechanisms to feed and receive substrates. This mechanism is a double-station mechanism that can ensure that the machine does not stop when changing magazines. This mechanism has been verified to be stable and reliable, and contains stp format, so you can download it with confidence!
Specification: Automatic Feeding And Receiving Mechanism For LED Die Bonding Machine Substrate – 3D Model ProE Creo.Parametric
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Automatic Feeding And Receiving Mechanism For LED Die Bonding Machine Substrate – 3D Model ProE Creo.Parametric
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