Automatic Chip Molding Equipment Semiconductor Integrated Circuit Back-Channel Packaging SolidWorks 3D Model

This equipment mechanism is designed by SW2016 and contains editable part features. Applicable to semiconductor integrated circuit production process (back-end packaging) in the chip component placement, to realize the dispensing, dipping, sticking, chip placement, wafer sticking, inverted package, GaAs, sticking pressure can be controlled, high precision. Adopting precision magnetic levitation motion platform, the main system X, Y axis adopts contactless and frictionless magnetic levitation system with high resolution linear encoder. The encoder scale reaches 0.02μm precision, which can realize high-speed, precision, sub-micron positioning. Rotation Angle: The equipment is equipped with a 360 degree rotation function, with a rotation resolution accuracy of 0.01 degrees, which can realize chip placement at any angle during the assembly process. Includes STP and UG universal editable format.