Automatic Assembly Line For 128G Card For Optical Communication SolidWorks 3D Model

This equipment mechanism designed by SW2016 contains parts features can be edited, this equipment for chip placement angle and positional accuracy requirements are high, the efficiency of the equipment does not require high, the whole machine has more than three cameras, compared with traditional machines, in addition to the Bang head linear motion characteristics, more than one can be a secondary positioning of the chip camera, to avoid the suction nozzle picking up the chip caused by the angle and positional changes according to the size of the chip, the The precision of chip placement can be kept within plus or minus 12~20um, which meets the requirement of TO package on product quality. Weight and power supply: about 800kg, 220 VAC; Power: 2000W; Air pressure and dispensing method: 4 bar ≤ P ≤ 6 bar, air extrusion and adhesive type optional; Chip: 0.2mm x 0.2mm ~ 1mm x 1mm; Chip loading: 6-inch WAFER disk with crystal expansion ring or TRAY disk; Vision system: WAFER disk with 3 visual positioning systems, TRAY disk with 2 visual positioning systems. TRAY disk 2 vision positioning system; control mode: industrial control machine; UPH: 1000~2000 PCS; placement accuracy: ±20 um, within ±0.5°. Includes STP and UG universal editable format.