Mobile Phone Motherboard Plug-In And Pull-Out Voltage Withstand Test Equipment (Including DFM) – 3D Model SolidWorks
Mobile phone motherboard testing equipment, using a robot gripper vacuum adsorption loading method, two groups of 6-station turntable test modules on the left and right, plug-in test, straightness test, pressure test, two groups of XYZ plus vacuum adsorption modules to grab into the test machine, test pressure resistance and power on test
Specification: Mobile Phone Motherboard Plug-In And Pull-Out Voltage Withstand Test Equipment (Including DFM) – 3D Model SolidWorks
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Mobile Phone Motherboard Plug-In And Pull-Out Voltage Withstand Test Equipment (Including DFM) – 3D Model SolidWorks
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