2.5mm Copper Foil Wire Bonding Machine (Fifth Edition) – 3D Model SolidWorks
The 2.5mm copper foil soldering machine is a core electronic component in the production of 5G mobile phone motherboards. A copper wire is soldered to the entire roll of copper foil, glued, and then the soldered copper foil is cut off with a cutter. It has been updated to the fifth generation and is a newly developed and improved machine. There are CAD processing drawings that have been sorted out. It is worth collecting, learning, and even processing into finished products.
Specification: 2.5mm Copper Foil Wire Bonding Machine (Fifth Edition) – 3D Model SolidWorks
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2.5mm Copper Foil Wire Bonding Machine (Fifth Edition) – 3D Model SolidWorks
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