Semiconductor Packaging Equipment DB Discharge Module – 3D Model ProE

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Magazine discharging module: The lead frame or substrate after chip bonding is sent to the magazine discharging module via a conveyor mechanism for storage and neatly stacked in the magazine. Empty materials can be automatically replaced when the magazine is full. box. This module is a commonly used standard module in Die Bonder or semiconductor equipment. Contains stp version, welcome to download!

Specification: Semiconductor Packaging Equipment DB Discharge Module – 3D Model ProE

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Semiconductor Packaging Equipment DB Discharge Module – 3D Model ProE
Semiconductor Packaging Equipment DB Discharge Module – 3D Model ProE
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