LED Die Bonding Machine Chip Mounter Semiconductor Substrate Clamping Mechanism – 3D Model ProE Creo.Parametric
This mechanism is a commonly used substrate clamping and placement mechanism in LED die bonders and placement machines. The clamping claws can be used with the extension of the tension spring to achieve slight clamping and placement of the substrate without causing deformation of the substrate. This mechanism has been verified to be stable and reliable, and contains the stp format, which can be downloaded with confidence!
Specification: LED Die Bonding Machine Chip Mounter Semiconductor Substrate Clamping Mechanism – 3D Model ProE Creo.Parametric
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LED Die Bonding Machine Chip Mounter Semiconductor Substrate Clamping Mechanism – 3D Model ProE Creo.Parametric
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