LED Die Bonding Machine Substrate Feeding And Dividing Mechanism – 3D Model ProE
This structure is a substrate feeding and distributing mechanism in LED die bonder. The stacked substrates are manually placed in the substrate placement area, and the Z-axis lifting mechanism rises. The clamping mechanism takes the substrate, and the cylinder moves the clamping mechanism to perform two-station feeding and distributing. This mechanism has been verified to be stable and reliable, and contains the stp format, which can be downloaded with confidence!
Specification: LED Die Bonding Machine Substrate Feeding And Dividing Mechanism – 3D Model ProE
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