Optocoupler Automatic Assembly Line Equipment – 3D Model SolidWorks

This device mechanism is designed by SW2016 and includes editable part features. The photocouplers in the thin SO6L package, “TLP5705H” and “TLP5702H”, can be used as insulated gate driver ICs in small IGBT/MOSFET. The use of rack mounter positioning improves the yield rate and production efficiency. The thin assembly (SO6L) with a thickness of only 2.3 mm (maximum) can provide products with a peak output current rating of ±5.0A. Reasonable design of assembly action beats improves accuracy and efficiency, and increases the process of ensuring yield. Small and medium-sized inverters and servo amplifiers that amplify current in buffer circuits directly drive their IGBT/MOSFET through this photocoupler. The peak output current rating of the TLP5702H is ±2.5A. The SO6L package is compatible with the pads of the SDIP6 package, which can provide greater flexibility for circuit board component layout and support back-side mounting of the circuit board. The component loading method is that two sets of cylinders simultaneously level the deformed pins up and down. The upper cylinder and the whole foot pressure block are responsible for leveling. The speed can reach 2000, which has a wide range of applications and is used for new circuit designs with limited device height. The maximum operating temperature rating reaches 125℃ (Ta＝-40℃ to 125℃), making it easier to design and maintain temperature margin. Lead forming options for SO6L (LF4) package. High peak output current rating (@Ta＝-40℃ to 125℃) IOP＝±2.5A (TLP5702H) IOP＝±5.0A (TLP5705H) Thin SO6L package High operating temperature rating: Topr (maximum)＝125℃ Main specifications ℃, @Ta＝-40℃ to 125. Contains STP and UG universal editable formats.