Chip Component High Temperature Test After The Carrier Tape Packaging Machine – 3D Model SolidWorks

Add to wishlistAdded to wishlistRemoved from wishlist 0

This Project only for Members

A

3D model of SMD component high temperature test and packaging machine SolidWorks2014 software design Sldprt, Sldasm source files + STEP general files are provided. After the SMD components are tested, they are directly loaded into the carrier tape and put on the SMT machine. This machine can test multiple components at the same time. The equipment is referred to as high temperature test packaging machine. After decompression, it is more than 120M, with a relatively complete structure. It is a good model for learning and research. Welcome to download.

Specification: Chip Component High Temperature Test After The Carrier Tape Packaging Machine – 3D Model SolidWorks

Industrial Use

Design Software

Version

Editable

File Formats

, ,

Sharing Level

User Reviews

0.0 out of 5
0
0
0
0
0
Write a review

There are no reviews yet.

Be the first to review “Chip Component High Temperature Test After The Carrier Tape Packaging Machine – 3D Model SolidWorks”

Chip Component High Temperature Test After The Carrier Tape Packaging Machine – 3D Model SolidWorks
Chip Component High Temperature Test After The Carrier Tape Packaging Machine – 3D Model SolidWorks
3D Mechanical Design Library
Logo
Shopping cart